Product Name: Defoamer/Deaerator (Organosilicon and Polymer Composite System)
Brand Model: BYK - A530
Packaging Specifications: 20 kg/blue iron drum, 160 kg/blue iron drum. The 20 kg specification is suitable for laboratory research and development, small - batch production or occasional use scenarios, facilitating precise dosage control; the 160 kg specification is suitable for large - scale industrial production, which can reduce unit packaging and transportation costs and meet the needs of continuous production.
Core Component: Organosilicon and polymer composite system, combining the characteristics of organosilicon to efficiently reduce surface tension and the system compatibility advantage of polymers. While defoaming and degassing, it reduces the negative impact on the surface properties of coatings or products.
Product Performance and Advantages
Efficient Defoaming and Degassing Ability: For solvent - based and solvent - free coatings, plastic systems (room temperature curing and pultrusion processes), adhesives and sealants, etc., it can quickly break the bubbles involved in the stirring and construction process and promote the discharge of residual gas during curing. For example, in the pultrusion molding of epoxy resin (such as the production of glass fiber reinforced epoxy resin profiles), it can eliminate the bubbles when the resin is compounded with fibers, avoid voids inside the profiles, and improve the mechanical strength.
Wide System Applicability:
Coating Field: Suitable for solvent - based coatings (such as acrylic polyurethane topcoats), solvent - free coatings (epoxy anti - corrosion paints) to solve the problems of pinholes and bubbles after coating curing;
Plastics and Composites: Especially recommended for epoxy resin systems (such as wind turbine blades, electronic potting compounds), and also suitable for room temperature curing plastic systems and pultrusion processes (such as the production of FRP pipes);
Adhesives and Sealants: When used in polyurethane sealants and epoxy adhesives, it can prevent bubbles from appearing after curing and ensure bonding strength and sealing performance.
Excellent Surface Effect Optimization: When used as a deaerator, it can reduce the surface tension of the system, improve the wettability of the coating to the substrate (such as metal, concrete), and reduce surface defects (such as craters, fish eyes) caused by residual bubbles. In the construction of epoxy floor paint, it can make the floor surface smoother and more beautiful, and improve the aesthetics and durability.
Special Process Adaptability: Especially suitable for continuous forming and processing scenarios such as pultrusion process. In the pultrusion molding process, the resin system needs to quickly penetrate the fibers and discharge gas. BYK - A530 can accelerate the escape of bubbles, ensure uniform density of profiles, and reduce strength fluctuations caused by bubbles.
Scope of Application and Scenarios
Main Application Fields:
Composite Material Production: Epoxy resin pultruded profiles (cable trays, door and window frames), glass fiber reinforced plastic (FRP) products, epoxy resin systems for wind turbine blades;
Coating Industry: Solvent - based industrial coatings, solvent - free epoxy anti - corrosion coatings, polyurethane coatings;
Wind Turbine Blade Manufacturing: In the compounding process of epoxy resin and glass fiber, BYK - A530 can eliminate bubbles in the resin, avoid air holes inside the blades, improve fatigue resistance and prolong service life;
Production of FRP Pipes by Pultrusion Process: During pultrusion molding, it helps the resin to quickly infiltrate the fibers and degas, ensuring that the pipe wall is dense without bubble defects, and enhancing corrosion resistance and pressure bearing capacity;
Application of Electronic Potting Compound: When epoxy potting compound is used to package electronic components, it eliminates bubbles in the glue, prevents poor heat dissipation or reduced electrical performance caused by bubbles, and ensures the stability of electronic products.
Usage and Storage Recommendations
Adding Method:
The recommended dosage is 0.1% - 0.5% of the total formula, which needs to be adjusted according to the system viscosity, bubble severity and process requirements (for example, the dosage can be appropriately increased to 0.3% - 0.5% in the pultrusion process);
It can be added directly during the resin mixing stage or after dilution with a solvent. The stirring time should be no less than 15 minutes to ensure uniform dispersion. Especially in the pultrusion process, it is necessary to ensure that the additive is fully mixed with the resin.
Compatibility Test: When using for the first time or replacing raw materials such as resins and curing agents, a small test is required to verify the compatibility with the system, and observe whether there are phenomena such as turbidity, delamination or affecting the curing speed to avoid affecting product performance.
Storage Conditions:
Store in a cool and dry place at 5 - 35℃, avoid direct sunlight or freezing, and prevent the failure of organosilicon components;
After opening, it needs to be sealed and stored to prevent moisture absorption or contamination. The shelf life of unopened products is 12 months, and the performance needs to be retested before use after expiration.
