Packaging Specifications: 25 kg/blue iron drum, 170 kg/blue iron drum. The 25 kg package is convenient for small enterprises, laboratories, or scenarios with low usage, while the 170 kg package suits large - scale manufacturers to reduce packaging replacement frequency and procurement costs.
Core Component: Non - silicon (free of organic silicon), which avoids issues like surface craters or reduced interlayer adhesion caused by silicon introduction in silicon - sensitive systems, ensuring stable product performance.
Product Performance and Advantages
High - Efficiency Defoaming: As an efficient defoamer, BYK - A501 rapidly eliminates bubbles in unsaturated polyester resins, polyurethanes, and epoxy systems. For example, in fiberglass production with unsaturated polyester resins, it removes bubbles generated during stirring to prevent defects like pores and uneven surfaces, improving product quality and yield.
Wide Applicability: Suitable for almost all unsaturated polyester resins and processing technologies, especially recommended for polyurethane, epoxy, adhesive, and casting systems. In epoxy floor coating construction, it adapts to both solvent - based and solvent - free systems, ensuring a smooth, bubble - free surface.
Excellent Compatibility: Compatible with unsaturated polyester, polyurethane, and epoxy resins without adverse reactions, and does not affect key properties like curing performance, hardness, or gloss. It maintains transparency in clear polyurethane coatings, preserving the product’s aesthetic effect.
Adhesive Industry: Scenarios requiring bubble control in adhesive production to ensure uniform application and strong bonding.
Casting Industry: Eliminates bubbles in raw materials during casting (e.g., crafts, molds) for smooth surfaces and dense internal structures.
Typical Scenarios:
Fiberglass Production: Used in large fiberglass tanks or hulls to remove bubbles from unsaturated polyester resins, enhancing mechanical strength and corrosion resistance.
Epoxy Adhesive Applications: Prevents bubbles in electronic component bonding to ensure firm connections and improve product stability.
Usage and Storage Recommendations
Addition Method: Recommended dosage is 0.1% - 0.5% of the total formula (determined by tests). Add during mixing of resins or adhesives, ensuring thorough stirring for uniform dispersion. Dilute before adding if the system viscosity is high.
Compatibility Test: Conduct small - scale tests before first use or when changing raw material systems to verify compatibility with components (e.g., curing agents, pigments) and avoid issues like turbidity or curing delays.
Storage Conditions: Store in a cool, dry, ventilated place at 5 - 35℃, away from direct sunlight, high temperatures, and freezing. Seal after opening to prevent moisture, oxidation, or contamination. Unopened products have a shelf life of 12 months.
